HEJ DANIEL AB · STOCKHOLM, SE
Senior electronics engineer in Stockholm. I take hardware from a blank schematic all the way to a signed Declaration of Conformity: board design, high-speed and RF, power electronics, EMC, and enough firmware to bring the thing up.
AUGUST 2025 · PRESENT
I lead the team and own the backlog, and I still do the design work. Running a hardware team is a lot easier when you stay in the schematics yourself.
Schematic through layout, 4 to 10 layers, mixed-signal, in Altium Designer. Custom stackups built for signal integrity, thermal, and EMC constraints instead of pulled off a template.
MIPI, Gigabit Ethernet, DDR3, LVDS, and RF chains from 130 MHz to 1 GHz. Impedance control, microstrip and stripline, filters, LNAs, VGAs, and PAs.
Isolated flyback AC/DC and DC/DC converters, up to 11 kW+ in EV charging, designed to IEC 61851 and IEC 62752. Buck, boost, and flyback topologies simulated in LTspice before they're built.
The full route: directive analysis, picking harmonised standards, in-house pre-compliance testing, lab coordination, and authoring the Declaration of Conformity. Radiated and conducted emissions and immunity, plus the redesigns that get you through.
Real-time C on ARM Cortex-M and ESP32, with FreeRTOS, ESP-IDF, and application-layer Modbus, BACnet, and DALI. Enough firmware to bring a board up and prove it works.
Prototype validation, test environments and rigs, production line setup and test integration, component lifecycle and RoHS/REACH compliance, PLM in Aras Innovator and Siemens Teamcenter.
Altium Designer · multi-layer PCB design · high-speed interface design (MIPI, Gigabit Ethernet, DDR3) · signal integrity, impedance control and stackup design · PCB bring-up and debugging · IPC-7351 and IPC-J-STD-001 · component lifecycle management (RoHS, REACH) · LTspice simulation · power electronics design · oscilloscopes, spectrum analysers and VNAs · embedded C · UART, SPI, I²C, GPIO, PWM, ADC · ESP32 / ESP-IDF · Modbus, BACnet, DALI
CE compliance ownership for RED products · FPC design for space-constrained products · RF circuit design, 130 MHz–1 GHz · EV charging systems to IEC 61851 and IEC 62752 · building automation to EN 50491 · Aras Innovator and Siemens Teamcenter · production line setup and validation · fine-pitch, SMT and BGA hand-soldering and rework · FreeRTOS · REST API integration
Git and CI integration · WebSocket communication · ESP-IDF, STM32CubeIDE and mixed toolchains · Linux systems: systemd, journald, sysfs GPIO, Modbus tooling, serial devices, shell scripting
Java and Python scripting · Android app development · Jenkins, Gerrit and automated build pipelines
DEVWARD · 2024–2025
Led the full product design of a patented building automation device that cuts HVAC energy use by 50%.
Twelve sensors, an RK3566 running embedded AI, and more than ten wired and wireless protocols on one 6-layer board.
Took the whole CE process in-house: standards selection, EMC testing, Declaration of Conformity.
CTEK · 2019–2020
Led the electronics development of a compact 11 kW charger with isolated AC/DC and DC/DC conversion, built to meet safety and EMC requirements from the start.
4–6 layer boards in Altium carrying Gigabit Ethernet, Wi-Fi, and BLE alongside the power stage.
Ran EMC pre-testing and the redesigns that came out of it.
TOBII · 2022–2024
Electronics for eye tracking inside AR/VR headsets, where every millimetre and milliwatt is contested.
Compact multi-layer flexible circuits, high-speed infrared camera modules over MIPI, and rigid mainboards built around Tobii's EyeChip ASIC with multiple cameras, LED drivers, and eye-safety circuits.
Ran customer-specific integrations for Meta, Sony, and Qualcomm.
SAAB TRANSPONDERTECH · 2018–2019
Maritime base station hardware from concept to pre-production, mixing RF, power up to 240 W, and high-speed digital on the same board.
6–10 layer designs with custom stackups to hold signal integrity, thermal, and EMC together in a mixed-signal environment.
Verified with spectrum and network analysers.
Team lead and backlog owner.
Co-founded a deeptech/proptech startup building a patented multi-sensor IoT device for building automation. Took it from concept to production, raised 6 MSEK, and ran everything from the 6-layer PCB to pricing and investor reporting.
Electronics for XR products: flexible circuits, MIPI camera modules, EyeChip mainboards, and customer integrations with Meta, Sony, and Qualcomm.
Power electronics for Mode 2 and 3 EV chargers, 11 kW and up, plus the high-speed digital, RFID, and EMC work around them.
New embedded hardware from concept to pre-production, combining RF, power, and high-speed digital on 6–10 layer boards.
Embedded C/C++ on AVR, ESP32, and nRF52840 for next-generation air care prototypes, including retrofitting legacy appliances with BLE and Wi-Fi.
Android TV apps for OTT/IPTV: streaming, authentication, EPG, DRM.
BSc Telecommunications Engineering, Miguel Hernández University, Alicante · 2013–2017
Swedish, bilingual · English, bilingual · Spanish, native
Electronic Systems Design for EMC Compliance, LearnEMC, 2021 · Advanced Altium Designer Training, Altium, 2020 · RF Measurements, KTH and Rohde & Schwarz, 2019
Hej Daniel AB is the company behind the work on this page. Right now it invoices my electronics contracting. It's also where new things start out. When something finds its footing, it moves into a company of its own with Hej Daniel as the parent.
A via is the plated hole that connects one layer of a circuit board to the next. That felt like a reasonable name for whatever holds the layers together.
ORG.NR 559583-6494 · REGISTERED IN SWEDEN · VAT SE559583649401 · F-SKATT
Contract work, design reviews, EMC trouble, or a conversation about something you're building. Stockholm-based, on site or remote.